[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Interfacial reliability and micropartial stress analysis between TSV and CPB through NIT and MSA
Lee, Gyujei, Kim, Yu-hwan, Jeon, Suk-woo, Byun, Kwang-yoo, Kwon, DongilYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898700
File:
PDF, 1.56 MB
english, 2011