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[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Evaluation of the Thermal Resistance of CSOP24 Ceramic Package
Peng, Xiao, Wang, Shuidi, Jia, Songliang, Cai, Jian, Huang, Qiang, Ding, RongzhenYear:
2007
Language:
english
DOI:
10.1109/icept.2007.4441523
File:
PDF, 925 KB
english, 2007