Suppressor Effects during Copper Superfilling of Sub-100 nm...

Electrochemical and Solid-State Letters 2009 Vol. 12; Iss. 4

Suppressor Effects during Copper Superfilling of Sub-100 nm Lines

Huang, Q., Baker-O’Neal, B. C., Kelly, J. J, Broekmann, P., Wirth, A., Emnet, C., Martin, M., Hahn, M., Wagner, A., Mayer, D.
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Volume:
12
Year:
2009
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.3078074
File:
PDF, 370 KB
english, 2009
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