![](/img/cover-not-exists.png)
[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Decapsulation methods for Cu interconnection packages
Ma, Xiaosong, Yang, D.G., Zhang, G.Q.Year:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474864
File:
PDF, 506 KB
english, 2012