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[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - High-temperature Conductive-AFM technique for resolution of soft failures
Huat, Lim Soon, Sun Wanxin,, Narang, Vinod, Chin, J.M.Year:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232667
File:
PDF, 11.31 MB
english, 2009