IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1996 / 5 Vol. 19; Iss. 2
A chips-first multichip module implementation of passive and active test coupons utilizing Texas Instruments' high density interconnect technology
Schaefer, T.M., Kacines, J.J., Randall, B.A., Roszel, L.E., Fokken, G.J., Walter, D., Schwab, D.J., Mowatt, L., Gilbert, B.K.Volume:
19
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.496045
Date:
May, 1996
File:
PDF, 2.21 MB
english, 1996