Effects of collimator aspect ratio and deposition temperature on copper sputtered seedlayers
Cooney, E. C., Strippe, D. C., Korejwa, J. W., Simon, A. H., Uzoh, C.Volume:
17
Year:
1999
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.581701
File:
PDF, 1.67 MB
english, 1999