![](/img/cover-not-exists.png)
[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Effect of deposit microstructure on the reflow discoloration of electroplating pure tin
Sun, Hongqi, Sun, Jiangyan, Ding, Dongyan, Chen, Chun, Li, Ming, He, YanfengYear:
2011
Language:
english
DOI:
10.1109/isapm.2011.6105731
File:
PDF, 3.26 MB
english, 2011