A comparison between aluminum and copper interactions with...

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films 1989 / 5 Vol. 7; Iss. 3

A comparison between aluminum and copper interactions with high-temperature oxide and nitride diffusion barriers

Charai, A.
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Volume:
7
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.575840
Date:
May, 1989
File:
PDF, 1011 KB
english, 1989
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