[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - SuperiorDrop test performance of BGA assembly using SAC105Ti solder spheres - virtual fracture analysis
Liu, Weiping, Lee, Ning-ChengYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474645
File:
PDF, 1.20 MB
english, 2012