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Quantitative evaluation of bonding energy for the interfaces in Cu metallization systems
Kamiya, Shoji, Suzuki, Shigeori, Yamanobe, Kiichiro, Saka, MasumiVolume:
99
Year:
2006
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.2168044
File:
PDF, 704 KB
english, 2006