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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Electrical simulation and analysis of Si interposer for 3D IC integration
Sun, Xin, Miao, Min, Zhu, Yunhui, Fang, Runiu, Wang, Guanjiang, Lu, Wengao, Chen, Jing, Jin, YufengYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897592
File:
PDF, 2.58 MB
english, 2014