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[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces - Braselton, GA, USA (14-17 March 1999)] Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) - Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages
Occhionero, M.A., Hay, R.A., Adams, R.W., Fennessy, K.P.Year:
1999
Language:
english
DOI:
10.1109/isapm.1999.757298
File:
PDF, 702 KB
english, 1999