![](/img/cover-not-exists.png)
[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Microstructure of Sn-Ag-Cu lead-free flip chip interconnects during aging
Wenfan Zhou,, Yanhong Tian,, Chunqing Wang,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564656
File:
PDF, 1.20 MB
english, 2005