[IEEE 2013 IEEE International Ultrasonics Symposium (IUS) -...

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[IEEE 2013 IEEE International Ultrasonics Symposium (IUS) - Prague, Czech Republic (2013.07.21-2013.07.25)] 2013 IEEE International Ultrasonics Symposium (IUS) - Design and fabrication of a new multi-active-layer transducer with a single-copper-layer FPCB

Eunhee Shin,, Sangseok Lee,, Jongkil Kim,, Byungkuk Bae,, Heewon Kim,, Susung Lee,, Yongrae Roh,
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Year:
2013
Language:
english
DOI:
10.1109/ultsym.2013.0504
File:
PDF, 1.38 MB
english, 2013
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