Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements
Gan, Dongwen, Ho, Paul S., Huang, Rui, Leu, Jihperng, Maiz, Jose, Scherban, TraceyVolume:
97
Year:
2005
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.1904720
File:
PDF, 785 KB
english, 2005