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[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Acceleration factor study of lead-free solder joints under wide range thermal cycling conditions
Ma, Hongtao, Ahmad, Mudasir, Liu, Kuo-ChuanYear:
2010
Language:
english
DOI:
10.1109/ectc.2010.5490719
File:
PDF, 1.07 MB
english, 2010