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Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction
Liu, Xi, Thadesar, Paragkumar A., Taylor, Christine L., Kunz, Martin, Tamura, Nobumichi, Bakir, Muhannad S., Sitaraman, Suresh K.Volume:
114
Year:
2013
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.4818327
File:
PDF, 5.15 MB
english, 2013