[IEEE 2009 IEEE 59th Electronic Components and Technology...

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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - A novel ultra-thin package for embedded high-pin-count LSI supported by Cu plate

Mori, Kentaro, Ohshima, Daisuke, Sasaki, Hideki, Fujimura, Yuki, Kikuchi, Katsumi, Nakashima, Yoshiki, Funaya, Takuo, Nishiyama, Tomohiro, Murakami, Tomoo, Yamamichi, Shintaro
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Year:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074202
File:
PDF, 1.98 MB
english, 2009
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