[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Inductors from wafer-level package process for high performance RF applications
Guruprasad, Badakere, Lin, Yaojian, Chelvam, M. Pandi, Yoon, Seung Wook, Liu, Kai, Frye, Robert C.Year:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416417
File:
PDF, 679 KB
english, 2009