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[IEEE 1997 International Conference on Multichip Modules - Denver, CO, USA (2-4 April 1997)] Proceedings 1997 International Conference on Multichip Modules - Fabrication of a DRAM cube using a novel laser patterned 3-D interconnect process
Malba, V., Liberman, V., Bernhardt, A.F.Year:
1997
Language:
english
DOI:
10.1109/icmcm.1997.581166
File:
PDF, 627 KB
english, 1997