Development of 0.45-mm thick ultra-thin small outline...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / Aug. Vol. 18; Iss. 3

Development of 0.45-mm thick ultra-thin small outline package

Omi, S., Maruyama, T., Ishio, T., Narai, A., Sota, Y., Toyosawa, K., Fujita, K., Maeda, T.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.404104
Date:
January, 1995
File:
PDF, 765 KB
english, 1995
Conversion to is in progress
Conversion to is failed