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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Investigation of low-temperature deposition high-uniformity coverage Parylene-HT as a dielectric layer for 3D interconnection
Tung, Bui Thanh, Cheng, Xiaojin, Watanabe, Naoya, Kato, Fumiki, Kikuchi, Katsuya, Aoyagi, MasahiroYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897565
File:
PDF, 3.20 MB
english, 2014