[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Chip to wafer direct bonding technologies for high density 3D integration
Sanchez, L., Bally, L., Montmayeul, B., Fournel, F., Dafonseca, J., Augendre, E., Di Cioccio, L., Carron, V., Signamarcheix, T., Taibi, R., Mermoz, S., Lecarpentier, G.Year:
2012
Language:
english
DOI:
10.1109/ectc.2012.6249108
File:
PDF, 2.35 MB
english, 2012