Seam-free fabrication of submicrometer copper interconnects by iodine-catalyzed chemical vapor deposition
Pyo, Sung Gyu, Kim, Sibum, Wheeler, D., Moffat, T. P., Josell, D.Volume:
93
Year:
2003
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.1532931
File:
PDF, 509 KB
english, 2003