Preparation and Temperature Cycling Reliability of...

IEEE Transactions on Components and Packaging Technologies 2007 / 03 Vol. 30; Iss. 1

Preparation and Temperature Cycling Reliability of Electroless Ni(P) Under Bump Metallization

Chen, Weimin, McCloskey, Paul, Rohan, James F., Byrne, Patrick, McNally, Patrick J.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.892094
Date:
March, 2007
File:
PDF, 2.17 MB
english, 2007
Conversion to is in progress
Conversion to is failed