Metallurgical reactions at the interface of Sn/Pb solder...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / Aug. Vol. 18; Iss. 3

Metallurgical reactions at the interface of Sn/Pb solder and electroless copper-plated AlN substrate

Bi-Shiou Chiou,, Jiann-Haur Chang,, Jenq-Gong Duh,
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.404113
Date:
January, 1995
File:
PDF, 580 KB
english, 1995
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