Grain Deformation and Strain in Board Level SnAgCu Solder...

IEEE Transactions on Components and Packaging Technologies 2007 / 03 Vol. 30; Iss. 1

Grain Deformation and Strain in Board Level SnAgCu Solder Interconnects Under Deep Thermal Cycling

Park, Seungbae, Dhakal, Ramji, Lehman, Lawrence, Cotts, Eric J.
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.892101
Date:
March, 2007
File:
PDF, 1.65 MB
english, 2007
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