[IEEE TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Beijing, China (2011.06.5-2011.06.9)] 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection
Makihata, M., Tanaka, S., Muroyama, M., Matsuzaki, S., Yamada, H., Nakayama, T., Yamaguchi, U., Mima, K., Nonomura, Y., Fujiyoshi, M., Esashi, M.Year:
2011
Language:
english
DOI:
10.1109/transducers.2011.5969490
File:
PDF, 883 KB
english, 2011