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[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - A Comprehensive study of reliability improvement for 65nm Cu/Low-k process
Liao, C. C., Gan, Z. H., Wu, Y. J., Zheng, K., Guo, R., Zhang, L. F., Ning, JayYear:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232554
File:
PDF, 5.83 MB
english, 2009