Highly-enhanced reflow characteristics of sputter deposited Cu alloy thin films for large scale integrated interconnections
Onishi, Takashi, Mizuno, Masao, Yoshikawa, Tetsuya, Munemasa, Jun, Mizuno, Masataka, Kihara, Teruo, Araki, Hideki, Shirai, YasuharuVolume:
110
Year:
2011
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.3611177
File:
PDF, 3.26 MB
english, 2011