Effect of (Au, Ni)Sn$_{4}$ Evolution on Sn-37Pb/ENIG Solder Joint Reliability Under Isothermal and Temperature-Cycled Conditions
Davis, J. A., Bozack, M. J., Evans, J. L.Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.892065
Date:
March, 2007
File:
PDF, 4.66 MB
english, 2007