[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Electromigration of SnAg bump with Ni UBM on various substrate pad finishes with SnCu presolder
Yeh, Tung-Chin, Tsai, Tsung-Fu, Lin, Larry, Hsieh, Roger, Wu, KennethYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6249002
File:
PDF, 2.34 MB
english, 2012