IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1994 / Aug. Vol. 17; Iss. 3
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A new packaging technique using a film carrier for laser diode arrays
Usui, M., Katsura, K., Hayashi, T., Hosoya, M., Sato, K., Sekine, S., Toba, H.Volume:
17
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.311789
Date:
January, 1994
File:
PDF, 832 KB
english, 1994