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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Impact of Sn3.0Ag0.5Cu solder powder size on the reliability of solder joints in high density led packages
Wang, Xinxin, Ma, Limin, Qi, Ya, Liu, Jianping, Guo, Fu, Liu, LiYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474871
File:
PDF, 655 KB
english, 2012