[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal design and analysis of high power LED with LTCC packaging
Hai, Yang, Yang, Daoguo, Yan, Dejin, Tian, WanchunYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474742
File:
PDF, 818 KB
english, 2012