Multi-chip packaging for high speed superconducting...

IEEE Transactions on Appiled Superconductivity 1995 / 6 Vol. 5; Iss. 2

Multi-chip packaging for high speed superconducting circuits

Sandell, R.D., Akerling, G., Smith, A.D.
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Appiled Superconductivity
DOI:
10.1109/77.403262
Date:
June, 1995
File:
PDF, 360 KB
english, 1995
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