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Study of adhesion and chemical bonds in the reaction layer formed at Cu-Mn interconnection/SiO2 interface
Hino, Aya, Okuno, Hiroyuki, Kugimiya, ToshihiroVolume:
113
Year:
2013
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.4803500
File:
PDF, 1.10 MB
english, 2013