![](/img/cover-not-exists.png)
[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Fluctuation Mechanism of Mechanical Properties of Electroplated-Copper Thin Films Used for Three Dimensional Electronic Modules
Miura, Hideo, Suzuki, Ken, Tamakawa, KinjiYear:
2007
Language:
english
DOI:
10.1109/esime.2007.360064
File:
PDF, 6.67 MB
english, 2007