![](/img/cover-not-exists.png)
[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Electromagnetic noise coupling analysis of TSV array by using cylindrical mode expansion method
Li, Jun, Yu, Hui-Chun, Luo, Xing-Yun, Huang, Xiao-Bo, Wei, Xing-Chang, Li, Er-PingYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922759
File:
PDF, 390 KB
english, 2014