The packaging of large spot-size optoelectronic devices

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / Nov. Vol. 20; Iss. 4

The packaging of large spot-size optoelectronic devices

Collins, J.V., Lealman, I.F., Fiddyment, P.J., Thurlow, A.R., Ford, C.W., Rogers, D.C., Jones, C.A.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.641508
Date:
January, 1997
File:
PDF, 305 KB
english, 1997
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