[IEEE 2010 18th IEEE/IFIP International Conference on VLSI...

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[IEEE 2010 18th IEEE/IFIP International Conference on VLSI and System-on-Chip (VLSI-SoC) - Madrid, Spain (2010.09.27-2010.09.29)] 2010 18th IEEE/IFIP International Conference on VLSI and System-on-Chip - Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs

Fengda Sun,, Cevrero, Alessandro, Athanasopoulos, Panagiotis, Leblebici, Yusuf
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Year:
2010
Language:
english
DOI:
10.1109/vlsisoc.2010.5642604
File:
PDF, 450 KB
english, 2010
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