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[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Reliability Analysis of SnPb and SnAgCu Solder Joints in FC-BGA Packages with Thermal Enabling Preload
Bhatti, P.K., Min Pei,, Xuejun Fan,Year:
2006
Language:
english
DOI:
10.1109/ectc.2006.1645711
File:
PDF, 962 KB
english, 2006