Plasma etch-back planarization coupled to chemical mechanical polishing for sub 0.18 μm shallow trench isolation technology
Schiltz, André, Palatini, Laëtitia, Paoli, Maryse, Rivoire, Maurice, Prola, AlainVolume:
18
Year:
2000
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.582346
File:
PDF, 978 KB
english, 2000