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[IEEE 1997 47th Electronic Components and Technology Conference - San Jose, CA, USA (18-21 May 1997)] 1997 Proceedings 47th Electronic Components and Technology Conference - Thermal study for flip chip on FR-4 boards
Tiao Zhou,, Hundt, M., Villa, C., Bond, R., Lao, T.Year:
1997
Language:
english
DOI:
10.1109/ectc.1997.606273
File:
PDF, 533 KB
english, 1997