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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Electromigration of 300 µm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package
Song Ye,, Mingliang Huang,, Leida Chen,, Xiaoying Liu,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582743
File:
PDF, 1.38 MB
english, 2010