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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Electro-migration of silver alloy wire with its application on bonding
Wang, Shenggang, Gao, Liming, Li, Ming, Huang, Dacheng, Qian, Ken, Chiu, HopeYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756583
File:
PDF, 2.18 MB
english, 2013