Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure
Lam, Jeffrey C. K., Huang, Maggie Y. M., Hau Ng, Tsu, Khalid Bin Dawood, Mohammed, Zhang, Fan, Du, Anyan, Sun, Handong, Shen, Zexiang, Mai, ZhihongVolume:
102
Year:
2013
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.4776735
File:
PDF, 1.20 MB
english, 2013