![](/img/cover-not-exists.png)
[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Enhanced thermal transport of hexagonal boron nitride filled polymer composite by magnetic field-assisted alignment
Lin, Ziyin, Liu, Yan, Moon, Kyoung-sik, Wong, Ching-PingYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575801
File:
PDF, 905 KB
english, 2013