FDTD analysis of the electrical performance for...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / Feb. Vol. 20; Iss. 1

FDTD analysis of the electrical performance for interconnection lines in multichip module (MCM) with perforated reference planes

Jin Zhao,, Zhengfan Li,
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.554522
Date:
January, 1997
File:
PDF, 195 KB
english, 1997
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